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SMARC-iMX8MQ

$165


  • NXP i.MX8M 4 x Cortex-A53 @1.5GHz
  • 2GB/4GB LPDDR4, 16GB eMMC
  • HDMI/DP, LVDS, 1x GBE, 2x MIPI-CSI
  • 2x CAN, 4x UART, 5x I2C, 2x I2S, 2x PCIe , 2x SPI, 2x USB3.0, 1x USB2.0 OTG and 4x USB2.0

 

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SKU: SMARC-iMX8M-Q-2G Category: Tag:

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SMARC-iMX8M NXP SMARC 2.0 System-on-Module


  • Quad/Dual-core ARM Cortex-A53, 1.5GHz
  • Real-time ARM Cortex-M4 co-processor, 266MHz
  • SMARC 2.0 (82mm x 50mm) Compliance
  • Availability guaranteed until 2038

Feature Highlights
SMARC logo
  • 2GB or 4GB LPDDR4 and 16GB eMMC
  • HDMI 2.0a/DP port resolution up to 4Kp60, 24-bit dual-channel LVDS (1080p), and 2 x MIPI-CSI (2-LANE and 4-LANE)
  • GPU (OpenGL ES 3.1, Open CL 1.2, OpenGL 3.0, OpenVG and Vulkan)
  • VPU (4Kp60 (h.265, VP9), 4Kp30 (h.264), 1080p60 (MPEG2, MPEG4p2, VC1, VP8, RV9, AVS/AVS+, h.263, DiVX), MJPEG)
  • 1 x GbE w/AVB, 2 x USB 3.0, 1 x USB OTG, 4 x USB 2.0, 2 x CAN, 4 x UARTs, 5 x I2C, 2 x I2S, 2 x PCIe 2.1 (1-LANE), 2 x SPI, 1 x SDIO, 12 x GPIOs
  • Wide temperature range of -40oC to 85oC

Yocto Project, Linux and RTOS
SMARC logo
  • Full Board Support Package and ready-to-run images
  • Linux kernel, Yocto Project BSP and U-Boot
  • Android
  • Ubuntu and Debian
  • Continuous BSP updates and maintenance

Speed Up your Product Design
  • Full carrier-board design package - schematics, BOM, PCB layout and 3D step files
  • Direct technical support by Embedian design engineers
  • Free design review by Embedian engineers
  • Carrier board debug by Embedian design engineers
  • Driver adaptation service for custom LCD panels

hardware document Specifications

Technical Information
Compliance
SMARC 2.0 Compliant
Dimension (W x L)
82mm x 50mm
CPU
  • NXP i.MX8M 4/2 x Cortex-A53 @1.5GHz
  • Real-time 266MHz ARM Cortex-M4
GPU
  • GC7000 Lite (3D)
  • OpenGL ES 3.1, OpenGL 3.0, Vulkan, Open CL 1.2
  • Up to 4Kp60 resolutions
VPU
  • Video Decode: 4Kp60 (h.265, VP9), 4Kp30 (h.264), 1080p60 (MPEG2, MPEG4p2, VC1, VP8, RV9, AVS/AVS+, h.263, DiVX), MJPEG
Main Memory
  • 32-bit 2GB/4GB LPDDR4 up to 3200MT/s
  • 16GB eMMC (5.x) onboard
  • AT24C32 EEPROM onboard
Display
  • HDMI 2.0a (up to 4Kp60)
  • Dual Channel LVDS display (up to 1920x1200@60Hz, interface vis MIPI-DSI by TI SN65DSI84 bridge)
MIPI-CSI Camera Interface
1 x 2-lane and 1 x 4-lane MIPI-CSI
SDIO
One SDIO interface
  • 1 x 4-bit SDIO card interface with support lines
SPI
Two SPI interfaces with 2 chip selects on each SPI channel
I2S
Two I2S interfaces
  • Typically used for connection to I2S audio CODECs
I2C
Six I2C interfaces
  • Power Management
  • General Purpose
  • Camera 0
  • LCD Display ID
  • HDMI
UART
  • Four asynchronous serial ports
  • Two with 4 wire handshake (RXD, TXD, RTS#, CTS#)
  • Two with data only (RXD, TXD)
CAN Bus
Two CAN 2.0b interfaces (via Microchip MCP2515 SPI to CAN bridge)
  • Logic level signals from Module based FlexCAN bus protocol controllers
  • RXD and TXD only
  • Maxmium baud rate at 250k without package loss.
USB
  • One USB OTG 2.0 Port with PHY
  • Four USB 2.0 Host with PHY
  • Two USB 3.0 Host with PHY
PCIe
  • 2 x PCIe 2.1 (1-Lane)
  • Common PCIe wake signal
Gigabit Ethernet
  • One GbE MDI interface
  • Realtek RTL-8211FD-CG PHY on module
  • No magnetics on Module
  • LED support signals
Real-Time Clock (RTC)
External Seiko S35390A controller on module
General Purpose I/O
12 x GPIO Signals, specific alternate functions are assigned to some GPIOs
  • PWM / Tachometer capability
  • Camera support
  • CAN Error Signaling
  • HD Audio reset
System and Power Management Signals
  • Reset Out and Reset In
  • Power Button Input
  • Power Source Sataus
  • Module Power State Status
  • System Management Pins
  • Battery and Battery Charger Management Pins
  • Carrier Power On Control Pins
Power Consumption
  • 3.6W (Typical)
  • 5.3W (Max)
Heat Sink
VTT-HS-8J066
  • Note: i.MX8MQ need heat sink
Boot Source Select
Three pins to allow selection from carrier board Select options include to boot from one of the following:
  • Module eMMC Flash (Default)
  • Network Boot
  • Carrier SD Card (Recovery)
Power Supply
3V to 5.25V
Operates directly from single level Lithium Ion cells, or fixed 3.3V or 5V power supply
  • 1.8V VDDIO
Temperature
Industrial Temperature
  • Operating Temperature Range: -45o C ~ 85o C
  • Storage Temperature Range: -40o C ~ 150o C
  • Junction Temperature Range: -40o C ~ 150o C
Form Factor
SMARC 2.0
82 mm x 50 mm by SMARC 2.0 Specification
 

hardware document Software Guides

Yocto Build
Version
Codename
U-Boot
Branch
Commit ID
Linux
Branch
Commit ID
Pre-Build Image
md5sum
4.2
Mickledore
2023.04
emb_lf_v2023.04
Commit ID
6.1.55
emb_lf-6.1.y
Commit ID
Pre-Build Image
md5sum
Yocto Build
Version
Codename
U-Boot
Branch
Commit ID
Linux
Branch
Commit ID
Pre-Build Image
md5sum
4.2
Mickledore
2023.04
emb_lf_v2023.04
Commit ID
6.1.55
emb_lf-6.1.y
Commit ID
Pre-Build Image
md5sum
Yocto Build
Version
Codename
U-Boot
Branch
Commit ID
Linux
Branch
Commit ID
Pre-Build Image
md5sum
4.2
Mickledore
2023.04
emb_lf_v2023.04
Commit ID
6.1.55
emb_lf-6.1.y
Commit ID
Pre-Build Image
md5sum
Item 3
Item 4
Item 5
Item 6
Item 4
Item 5
Item 6

hardware document Evaluation Kit

SMARC 2.1 Evaluation Baseboard


  • SMARC v2.0 module compliance
  • SMARC v2.0 module bring-up platform for hardware and software development
  • SMARC 2.0 module evaluation and validation platform
  • Customer carrier board design reference
  • Priority technical support from Embedian

Ordering Information
  • Part Number: EVK-STD-CARRIER-S20

Packing Lists
SMARC logo
  • 1 x EVK-STD-CARRIER-S20 carrier board
  • 4 x M2.5 screws
  • 1 x 16GB SDHC card with image pre-installed (only when purchase together with Embedian SMARC modules)
  • 1 x LVDS cable
  • 1 x LVDS LCD Backlight cable
  • 1 x 12V/3.5A Power Supply
  • 1 x SATA Power cable
  • 1 x 10-way box header to DB9 cable (for console or RS232)
  • SMARC module not included)

Evaluation Bseboard Features
SMARC logo
  • DC +12V ~ +24V Power input with 2.5mm DC Jack
  • Accept 1.8V VDDIO SMARC 2.0+ compliant module
  • Supports all SMARC 2.0+ I/O interfaces
  • Form factor: 170mm (L) x 170mm (W) (mini-ITX form factor)

hardware document Ordering Information

Part Number
1
  • Q: Quad Core Cortex-A53
  • D: Dual Core Cortex-A53 (Only for projects with quantity)
2
  • 2G: 2GB LPDDR4 memory
  • 4G: 4GB LPDDR4 memory
3
  • I: Industrial Temperature (-40oC ~ 85oC); Leave it blank if not needed
4
  • C: Conforrmal Coating (Only support it for industrial temperature variants and at the mass production stage); Leave it blank if not needed.

Example
  • Part Number: SMARC-iMX8M-Q-2G-I

Description: Quad core Cortex-A53 i.MX8M processor SMARC 2.0 module with 2GB LPDDR4, Industrial Temperature (-40oC ~ 85oC)

  • Part Number: SMARC-iMX8M-Q-4G

Description: Quad core Cortex-A53 i.MX8M processor SMARC 2.0 module with 4GB LPDDR4, Commercial Temperature (0oC ~ 60oC)


Optional Accessaries
Heat Sink
  • P/N: VTT-HS-8J066

Description: Heak sink for SMARC-iMX8M

Why choose Embedian?

NXP Golden Partner

TI Direct Account

A Culture of High Quality and Efficiency

Dedicated Only on ARM-Cortex Platform

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