Need help? Write to us contact@example.com

Please, enable Compare.
Saving your money for next purchases
Delivery - Usually ship in three working days

Online purchasing offers convenience during the sample development stage. For larger orders, please click the ‘Request a Quote’ button above. We will offer a much better discount price.

SMARC-iMX8MP

$165


  • NXP i.MX8M PLUS 4 x Cortex-A53 @1.8GHz
  • 2GB/4GB/6GB LPDDR4, 16GB eMMC
  • AI/ML Neural Processing Unit
  • HDMI, LVDS, 2x GBEs, 2x MIPI-CSI
  • 2 x CAN-FD, 4 x UARTs, 6 x I2C, 2 x I2S, 1 x PCIe3 , 2 x SPI, 4 x USB2.0, 1x USB 2.0 OTG, 2 x USB 3.0

 

or
SKU: SMARC-iMX8MP-Q-2G Category: Tag:

Share:

SMARC-iMX8MP NXP SMARC 2.1 System-on-Module


  • Quad/Dual-core ARM Cortex-A53, 1.8GHz
  • Real-time ARM Cortex-M7 co-processor, 800MHz
  • Integrated 2.3 TOPS AI/ML Neural Processing Unit
  • SMARC 2.1 (82mm x 50mm) Compliance
  • Availability guaranteed until 2038

Feature Highlights
SMARC logo
  • 2GB, 4GB or 6GB LPDDR4 and 16GB eMMC
  • Integrated AI/ML Neural Processing Unit (2.3 TOPs)
  • HDMI (4Kp30), 24-bit dual-channel LVDS (1080p), MIPI-DSI (1920x1440p60) and 2 x MIPI-CSI (2-LANE and 4-LANE)
  • GPU (OpenGL ES 3.0, Open CL 1.2, Vulkan)
  • VPU (Video Decode: 1080p60, h.265/4, VP9, VP8; Video Encode: 1080p60, h.265/4)
  • 2 x GbE w/TSN, 2 x USB 3.0, 1 x USB OTG, 4 x USB 2.0, 2 x CAN-FD, 4 x UARTs, 6 x I2C, 2 x I2S, 1 x PCIe 3.0 (1-LANE), 2 x SPI, TPM, 1 x SDIO, 12 x GPIOs
  • Wide temperature range of -40oC to 85oC

Yocto Project, Linux , Android, and RTOS
SMARC logo
  • Full Board Support Package and ready-to-run images
  • Linux kernel, Yocto Project BSP and U-Boot
  • Android
  • Ubuntu and Debian
  • Continuous BSP updates and maintenance

Speed Up your Product Design
  • Full carrier-board design package - schematics, BOM, PCB layout and 3D step files
  • Direct technical support by Embedian design engineers
  • Free design review by Embedian engineers
  • Carrier board debug by Embedian design engineers
  • Driver adaptation service for custom LCD panels

hardware document Specifications

Technical Information
Compliance
SMARC 2.1 Compliant
Dimension (W x L)
82mm x 50mm
CPU
  • NXP i.MX8M PLUS 4 x Cortex-A53 @1.8GHz
  • Real-time 800MHz ARM Cortex-M7
GPU
  • GC7000 Ultra Lite (3D) and GC520L (2D)
  • Supports OpenGL ES 3.1/3.0, Vulkan, Open CL 1.2 FP, OpenVG 1.1 and G2D
  • Supports upto 4Kp30 resolutions
VPU
  • Video Decode: 1080p60, h.265/4, VP9, VP8
  • Video Encode: 1080p60, h.265/4
Main Memory
  • 32-bit 2GB/4GB/6GB LPDDR4 up to 3200MT/s
  • 16GB eMMC (5.x) onboard
  • AT24C32 EEPROM onboard
NPU
  • 2.3 TOP/s Neural Network performance
  • Keyword detect, noise reduction, beamforming
  • Speech recognition (i.e. Deep Speech 2)
  • Image recognition (i.e. ResNet-50)
Display
  • HDMI 2.0a (up to 4Kp30)
  • Dual Channel LVDS display (up to 1920x1200@60Hz)
  • MIPI DSI (up to 1920x1440p60)
TPM
Support TPM 2.0
MIPI-CSI Camera Interface
1 x 2-lane and 1 x 4-lane MIPI-CSI
SDIO
One SDIO interface
  • 1 x 4-bit SDIO card interface with support lines
SPI
Two SPI interfaces with 2 chip selects on each SPI channel
I2S
Two I2S interfaces
  • Typically used for connection to I2S audio CODECs
I2C
Six I2C interfaces
  • Power Management
  • General Purpose
  • Camera 0
  • Cemera 1
  • LCD Display ID
  • HDMI
UART
  • Four asynchronous serial ports
  • Two with 4 wire handshake (RXD, TXD, RTS#, CTS#)
  • Two with data only (RXD, TXD)
FlexCAN Bus
Two CAN-FD interfaces (industrial temp. variant) or two CAN 2.0b interfaces (commercial temp. variant)
  • Logic level signals from Module based FlexCAN bus protocol controllers
  • RXD and TXD only
USB
  • One USB OTG 2.0 Port with PHY
  • Four USB 2.0 Host with PHY
  • Two USB 3.0 Host with PHY
PCIe
  • 1 x PCIe 3.0 1-Lane
  • Common PCIe wake signal
Gigabit Ethernet
  • Two GbE MDI interfaces (one supports QoS with TSN)
  • Realtek RTL-8211FD-CG PHY on module
  • No magnetics on Module
  • LED support signals
Real-Time Clock (RTC)
External Seiko S35390A controller on module
General Purpose I/O
12 x GPIO Signals, specific alternate functions are assigned to some GPIOs
  • PWM / Tachometer capability
  • Camera support
  • CAN Error Signaling
  • HD Audio reset
System and Power Management Signals
  • Reset Out and Reset In
  • Power Button Input
  • Power Source Sataus
  • Module Power State Status
  • System Management Pins
  • Battery and Battery Charger Management Pins
  • Carrier Power On Control Pins
Power Consumption
  • 3.5W (Typical)
  • 5.2W (Max)
Heat Sink
VTT-HS-8J066B1
  • Note: i.MX8M Plus need heat sink
Boot Source Select
Three pins to allow selection from carrier board Select options include to boot from one of the following:
  • Module eMMC Flash (Default)
  • Network Boot
  • Carrier SD Card (Recovery)
Power Supply
3V to 5.25V
Operates directly from single level Lithium Ion cells, or fixed 3.3V or 5V power supply
  • 1.8V VDDIO
Temperature
Industrial Temperature
  • Operating Temperature Range: -45o C ~ 85o C
  • Storage Temperature Range: -40o C ~ 150o C
  • Junction Temperature Range: -40o C ~ 150o C
Form Factor
SMARC 2.1
82 mm x 50 mm by SMARC 2.1 Specification
 

hardware document Software Guides

Yocto Build
Version
Codename
U-Boot
Branch
Commit ID
Linux
Branch
Commit ID
Pre-Build Image
md5sum
4.2
Mickledore
2023.04
emb_lf_v2023.04
Commit ID
6.1.55
emb_lf-6.1.y
Commit ID
Pre-Build Image
md5sum
Yocto Build
Version
Codename
U-Boot
Branch
Commit ID
Linux
Branch
Commit ID
Pre-Build Image
md5sum
4.2
Mickledore
2023.04
emb_lf_v2023.04
Commit ID
6.1.55
emb_lf-6.1.y
Commit ID
Pre-Build Image
md5sum
Yocto Build
Version
Codename
U-Boot
Branch
Commit ID
Linux
Branch
Commit ID
Pre-Build Image
md5sum
4.2
Mickledore
2023.04
emb_lf_v2023.04
Commit ID
6.1.55
emb_lf-6.1.y
Commit ID
Pre-Build Image
md5sum
Item 3
Item 4
Item 5
Item 6
Item 4
Item 5
Item 6

hardware document Evaluation Kit

SMARC 2.1 Evaluation Baseboard


  • SMARC v2.0 module compliance
  • SMARC v2.0 module bring-up platform for hardware and software development
  • SMARC 2.0 module evaluation and validation platform
  • Customer carrier board design reference
  • Priority technical support from Embedian

Ordering Information
  • Part Number: EVK-STD-CARRIER-S20

Packing Lists
SMARC logo
  • 1 x EVK-STD-CARRIER-S20 carrier board
  • 4 x M2.5 screws
  • 1 x 16GB SDHC card with image pre-installed (only when purchase together with Embedian SMARC modules)
  • 1 x LVDS cable
  • 1 x LVDS LCD Backlight cable
  • 1 x 12V/3.5A Power Supply
  • 1 x SATA Power cable
  • 1 x 10-way box header to DB9 cable (for console or RS232)
  • SMARC module not included)

Evaluation Bseboard Features
SMARC logo
  • DC +12V ~ +24V Power input with 2.5mm DC Jack
  • Accept 1.8V VDDIO SMARC 2.0+ compliant module
  • Supports all SMARC 2.0+ I/O interfaces
  • Form factor: 170mm (L) x 170mm (W) (mini-ITX form factor)

hardware document Ordering Information

Part Number
1
  • Q: Quad Core Cortex-A53
  • D: Dual Core Cortex-A53 (Only for projects with quantity)
2
  • 2G: 2GB LPDDR4 memory
  • 4G: 4GB LPDDR4 memory
  • 6G: 6GB LPDDR4 (only on request)
3
  • I: Industrial Temperature (-40oC ~ 85oC); Leave it blank if not needed
4
  • C: Conforrmal Coating (Only support it for industrial temperature variants and at the mass production stage); Leave it blank if not needed.

Example
  • Part Number: SMARC-iMX8MP-Q-2G-I

Description: Quad core Cortex-A53 i.MX8M PLUS processor SMARC 2.1 module with 2GB LPDDR4, Industrial Temperature (-40oC ~ 85oC)

  • Part Number: SMARC-iMX8MP-Q-4G

Description: Quad core Cortex-A53 i.MX8M PLUS processor SMARC 2.1 module with 4GB LPDDR4, Commercial Temperature (0oC ~ 60oC)


Optional Accessaries
Heat Sink
  • P/N: VTT-HS-8J066B1

Description: Heak sink for SMARC-iMX8MP

Why choose Embedian?

NXP Golden Partner

TI Direct Account

A Culture of High Quality and Efficiency

Dedicated Only on ARM-Cortex Platform

You may add any content here from XStore Control Panel->Sales booster->Request a quote->Ask a question notification

At sem a enim eu vulputate nullam convallis Iaculis vitae odio faucibus adipiscing urna.

Ask an expert