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SMARC-FiMX6 NXP SMARC 1.1/1.0 System-on-Module
- Quad/Dual/Dual Lite/Solo-core ARM Cortex-A9, 1.2GHz (800Mhz for industrial)
- SMARC 1.1 and 1.0 (82mm x 50mm) Compliance
- Availability guaranteed until 2030
Feature Highlights
- 2GB/1GB/512MB DDR3L and 8GB eMMC
- HDMI, 24-bit dual-channel LVDS (1080p), and 1 x MIPI-CSI (2-LANE)
- GPU 3D (Vivante GC2000) and GPU 2D (Vivante GC355 and GC320)
- VPU (Video Decode: 1080p60 h.264; Video Encode: 1080p30 H.264)
- 1 x GbE, 1 x USB 2.0 OTG, 1 x USB 2.0 Host, 2 x CAN, 4 x UARTs, 4 x I2C, 2 x I2S, 1 x PCIe 2.0 (1-LANE), 2 x SPI, 1 x SDIO, 12 x GPIOs
- Extended temperature range of -20oC to 80oC
Yocto Project, Linux and RTOS
- Full Board Support Package and ready-to-run images
- Linux kernel, Yocto Project BSP and U-Boot
- Ubuntu
- Android
- Continuous BSP updates and maintenance
Speed Up your Product Design
- Full carrier-board design package - schematics, BOM, PCB layout and 3D step files
- Direct technical support by Embedian design engineers
- Free design review by Embedian engineers
- Carrier board debug by Embedian design engineers
- Driver adaptation service for custom LCD panels
Specifications
Technical Information
Compliance
SMARC 1.1 and 1.0 Compliant
Dimension (W x L)
82mm x 50mm
CPU
- NXP i.MX6 4/2/1 x Cortex-A9 @1.2GHz (800Mhz for industrial temp.)
GPU
- Vivante GC2000 (3D)
- Vivante GC355 and GC320 (2D)
- Up to 1080p60 resolutions
VPU
- Video Decode: 1080p 60 h.264
- Video Encode: 1080p30 H.264
Main Memory
- 2GB/1GB(dual lite)/512MB(solo) DDR3L
- 8GB eMMC (5.x) onboard
- 4MB SPI NOR flash
- AT24C32 EEPROM onboard
Display
- HDMI 1.4
- Dual Channel LVDS display
- Up to 1080p60
MIPI-CSI Camera Interface
1 x 2-lane MIPI-CSI
SDIO
One SDIO interface
- 1 x 4-bit SDIO card interface with support lines
SPI
Two SPI interfaces with 2 chip selects on each SPI channel
I2S
One I2S interfaces
- Typically used for connection to I2S audio CODECs
I2C
Four I2C interfaces
- Power Management
- General Purpose
- Camera 0
- LCD Display ID
UART
- Four asynchronous serial ports
- Two with 4 wire handshake (RXD, TXD, RTS#, CTS#)
- Two with data only (RXD, TXD)
CAN Bus
Two CAN 2.0b interfaces
- Logic level signals from Module based FlexCAN bus protocol controllers
- RXD and TXD only
USB
- One USB OTG 2.0 Port with PHY
- One USB 2.0 Host Port with PHY
PCIe
- 1 x PCIe 2.0 (1-Lane)
- Common PCIe wake signal
Gigabit Ethernet
- One GbE MDI interface
- Realtek RTL-8211FD-CG PHY on module
- No magnetics on Module
- LED support signals
Real-Time Clock (RTC)
External Seiko S35390A controller on module
General Purpose I/O
12 x GPIO Signals, specific alternate functions are assigned to some GPIOs
- PWM / Tachometer capability
- Camera support
- CAN Error Signaling
- HD Audio reset
System and Power Management Signals
- Reset Out and Reset In
- Power Button Input
- Power Source Sataus
- Module Power State Status
- System Management Pins
- Battery and Battery Charger Management Pins
- Carrier Power On Control Pins
Power Consumption
- 1.55W-3.6W (Typical)
Heat Sink
VTT-HS-8J064
- Note: i.MX6 dual core and quad core need heat sink
Boot Source Select
Three pins to allow selection from carrier board
Select options include to boot from one of the following:
- Module NOR Flash (Default)
- Module eMMC Flash
- Network Boot
- Carrier SD Card (Recovery)
Power Supply
3V to 5.25V
Operates directly from single level Lithium Ion cells, or fixed 3.3V or 5V power supply
- 1.8V and 3.3V VDDIO (can accept both 1.8V or 3.3V VDDIO carrier board)
Temperature
Extended Temperature
- Operating Temperature Range: -40o C ~ 85o C
- Storage Temperature Range: -40o C ~ 150o C
- Junction Temperature Range: -40o C ~ 150o C
Form Factor
SMARC 1.0 and 1.1
82 mm x 50 mm by SMARC 1.1 Specification
Design Resources
Software Guides
Yocto Build
Version
Codename
U-Boot
Branch
Commit ID
Linux
Branch
Commit ID
Pre-Build Image
md5sum
4.2
Mickledore
2023.04
emb_lf_v2023.04
Commit ID
6.1.55
emb_lf-6.1.y
Commit ID
Pre-Build Image
md5sum
Yocto Build
Version
Codename
U-Boot
Branch
Commit ID
Linux
Branch
Commit ID
Pre-Build Image
md5sum
4.2
Mickledore
2023.04
emb_lf_v2023.04
Commit ID
6.1.55
emb_lf-6.1.y
Commit ID
Pre-Build Image
md5sum
Yocto Build
Version
Codename
U-Boot
Branch
Commit ID
Linux
Branch
Commit ID
Pre-Build Image
md5sum
4.2
Mickledore
2023.04
emb_lf_v2023.04
Commit ID
6.1.55
emb_lf-6.1.y
Commit ID
Pre-Build Image
md5sum
Item 3
Item 4
Item 5
Item 6
Item 4
Item 5
Item 6
Evaluation Kit
SMARC 2.1 Evaluation Baseboard
- SMARC v2.0 module compliance
- SMARC v2.0 module bring-up platform for hardware and software development
- SMARC 2.0 module evaluation and validation platform
- Customer carrier board design reference
- Priority technical support from Embedian
Ordering Information
- Part Number: EVK-STD-CARRIER-S20
Packing Lists
- 1 x EVK-STD-CARRIER-S20 carrier board
- 4 x M2.5 screws
- 1 x 16GB SDHC card with image pre-installed (only when purchase together with Embedian SMARC modules)
- 1 x LVDS cable
- 1 x LVDS LCD Backlight cable
- 1 x 12V/3.5A Power Supply
- 1 x SATA Power cable
- 1 x 10-way box header to DB9 cable (for console or RS232)
- SMARC module not included)
Evaluation Bseboard Features
- DC +12V ~ +24V Power input with 2.5mm DC Jack
- Accept 1.8V VDDIO SMARC 2.0+ compliant module
- Supports all SMARC 2.0+ I/O interfaces
- Form factor: 170mm (L) x 170mm (W) (mini-ITX form factor)
Ordering Information
1
- Q: Quad Core i.MX6 (Supports 1GB and 2GB DDR3L)
- D: Dual Core i.MX6 (Supports 1GB and 2GB DDR3L)
- U: Dual Lite Core i.MX6 (Only supports 1GB DDR3L)
- S: Solo Core i.MX6 (Only supports 512MB DDR3L)
2
- 1G: 1GB DDR3L
- 2G: 2GB DDR3L
- Leave it blank for solo core.
3
- I: Industrial Temperature (-40oC ~ 85oC); Leave it blank if commercial temperature.
4
- C: Conformal Coating (Only support it for industrial temperature variants and at the mass production stage); Leave it blank if not needed.
Example
- Part Number: SMARC-FiMX6-D-2G-I
- Part Number: SMARC-FiMX6-U-1G
Optional Accessaries
Heat Sink
- P/N: VTT-HS-8J064
Description: Heak sink for SMARC-FiMX6 dual core and quad core
Why choose Embedian?
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